Wafer e.g. substrate, deformation reducing method for use during production of e.g. microprocessor, involves determining deformation state of wafer and/or comparable wafer of bulk with measuring unit and automatically generating data record

摘要

The method involves determining a deformation state of a wafer (10) e.g. substrate, and/or a comparable wafer of a bulk with a measuring unit and automatically generating a deformation data record. An abrasion process is provided for partially removing a layer (1) on a rear side of the wafer and/or comparable wafer of the bulk. A parameter of the abrasion process is adjusted and/or controlled depending on the deformation data record, where the abrasion process takes place via a bundled ion beam. The abrasion process is designed as an etching process. An independent claim is also included for a device for reducing deformation of a wafer.