TAPE LAMINATING APPARATUS

摘要

A tape laminating apparatus is provided to prevent scratches on a wafer or a breakdown of the wafer by cutting a wafer protection film after loading a wafer protection plate on a wafer. A wafer(204) is loaded on a taping table(200). A protective film(202) is attached to the wafer. A cylinder(208) includes a wafer protection plate(206) formed at a lower end thereof. The wafer protection plate is loaded on the taping table in order to be loaded on the wafer to which the protective film is attached. The wafer protection plate of the cylinder is loaded on the wafer. A rotary cutter is formed to cut the protective film of the wafer along a shape of the wafer. The protective plate is formed with ceramic.