MOLDING METHOD OF THERMOSETTING RESIN AND MOLDING MACHINE THEREFOR

摘要

PROBLEM TO BE SOLVED: To control the conductive characteristics of heat to a resin from a mold up to the completion of filling by a simple constitution and to shorten a curing time without damaging filling properties (fluidizable properties). SOLUTION: The thermosetting resin molding method is constituted so as to interpose a release film 16 between a semiconductor substrate S and a cavity bottom part 12A includes a process of placing the release film 16 on the bottom part 12A of a cavity 12 in a non-sucked state in a front stage wherein a molding resin 14 is charged in a cavity 12, a process of charging/placing the molding resin 14 on the release film 16 in this state and a process of starting the adsorption of the release film 16 to the bottom part 12A of the cavity 12 of the release film after a predetermined time after charging. COPYRIGHT: (C)2008,JPO&INPIT