发明名称 Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body
摘要 A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.
申请公布号 US2007269927(A1) 申请公布日期 2007.11.22
申请号 US20070880717 申请日期 2007.07.23
申请人 OSRAM OPTO SEMICONDUCTORS GMBH 发明人 HOFER THOMAS;BRUNNER HERBERT;MOLLMER FRANK;WAITL GUNTER;SEWALD RAINER;ZEILER MARKUS
分类号 H01L21/58;B27N7/00 主分类号 H01L21/58
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