| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance planarization of the surface of a bump electrode being packaged so that sufficient conductivity can be ensured between a bump electrode on the side of a semiconductor device such as an LCD driver and the counterpart electrode such as an electrode on the side of a mounting board connected with the bump electrode while opposing. <P>SOLUTION: In the arrangement of a bump electrode 14, overlap range of the installation range of a wiring electrode 11 and the forming range of the bump electrode 14 is set smaller than the non-overlap range. The portion corresponding to the non-overlap range side of the bump electrode 14 is a bump electrode packaging portion 14a for ensuring conductivity by interposing an anisotropic conductive film 15 between that portion and an electrode 16a on the mounting board 16 side. The portion corresponding to the overlap range side is a bump electrode wiring portion 14b dedicated to electrical connection with the wiring electrode 11. The bump electrode packaging portion 14a is made larger than the bump electrode wiring portion 14b, and planarity of the electrode surface is enhanced. <P>COPYRIGHT: (C)2008,JPO&INPIT |
