| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board which can radiate heat emitted from a mounted electronic component, and can be reduced in its entire plate thickness. <P>SOLUTION: The multilayer wiring board 1 is provided with a core board 2 having a wiring pattern 3 and a wiring pattern 4 on its outermost layer, a wiring pattern 5 laminated on the wiring pattern 3 via an insulating layer 7, a wiring pattern 6 laminated on the wiring pattern 4 via an insulating layer 8, a copper bumps 9 for allowing the wiring pattern 3 to conduct with the wiring pattern 5, and copper bumps 10 for allowing the wiring pattern 4 to conduct with the wiring pattern 6. An electronic component 110 is mounted on the surface of the wiring pattern 5. On a position facing the electronic component 110, the wiring board 1 is provided with a heat radiating means 14 consisting of a copper bump 11 piercing through the insulating layer 7 and allowing the wiring pattern 3 to conduct with the wiring pattern 5; a heat radiating member 13 piercing through the core board 2 and having one end connecting to the copper bump 11; and a copper bump 12 piercing through the insulating layer 8, allowing the wiring pattern 4 to conduct with the wiring pattern 6, and connected to the other end of the heat radiating member 13. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
