| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor element capable of forming an in-layer lens with a desired form without exposing a metallic wire of a peripheral circuit, and to provide the semiconductor element. SOLUTION: The manufacturing method of the semiconductor element is provided with a semiconductor substrate 11, and pixel parts 10 and the peripheral circuit section 20 provided onto the semiconductor substrate 11. Further, the method includes a step of coating a nitride film 17 being a material of the in-layer lens onto the semiconductor substrate 11, coating a lens resist R patterned in matching with the shape of the in-layer lens, exposing the coated material to form the in-layer lens, and coating the lens resist R to an upper face of the nitride film 17 for covering a metallic wire part M of the peripheral circuit 20. COPYRIGHT: (C)2008,JPO&INPIT
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