| 摘要 |
A device ( 100 ) may use one or more conductive elements ( 112 ) to electrically couple a substrate ( 116 ) and a cap ( 114 ). In one embodiment, an acceleration sense element may be formed on the substrate ( 116 ), and the cap ( 114 ) may be used to provide hermetic protection to the acceleration sense element. In one embodiment, conductive elements ( 112 ) may be formed by dispensing conductive die attach material. Wire bonds (e.g. 322 ) bonded to bond pads (e.g. 332 ) on the substrate (e.g. 316 ) may be used to couple substrate ( 116 ), the conductive element pad ( 335 ), and the cap ( 114 ), to a desired predetermined potential.
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