发明名称 SOLID LASER APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain a solid laser apparatus capable of fixing a laser medium so that the medium cannot move, and reducing distortion in laser operation. SOLUTION: The solid laser apparatus is provided with a thin plate-like laser medium 1 for absorbing an excitation light to generate a gain, a heat sink 3 for discharging heat of the laser medium 1 to the outside, and a bonding agent 2 for bonding the laser medium 1 to the heat sink 3. The apparatus has a relation of Ts≥Td≥Th and a relation ofα(Ts-Td)≈η(Ts-Th), whereαis a linear expansion coefficient in a junction surface of the laser medium 1,ηis a linear expansion coefficient of the heat sink 3, Ts is a curing temperature of the bonding agent 2, Td is an operation temperature of the laser medium 1, and Th is an operation temperature of the heat sink 3. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007305733(A) 申请公布日期 2007.11.22
申请号 JP20060131528 申请日期 2006.05.10
申请人 MITSUBISHI ELECTRIC CORP 发明人 YANAGISAWA TAKAYUKI;HIRANO YOSHIHITO;YAMAMOTO SHUHEI;SEKI KOJI
分类号 H01S3/042 主分类号 H01S3/042
代理机构 代理人
主权项
地址