发明名称 Molding device for an expandable interspinous process implant
摘要 A molding device is disclosed and can include a first mold component and a second mold component substantially opposite the first mold component. The first mold component and the second mold component can fit around a superior spinous process and an inferior spinous process.
申请公布号 US2007270829(A1) 申请公布日期 2007.11.22
申请号 US20060414445 申请日期 2006.04.28
申请人 SDGI HOLDINGS, INC. 发明人 CARLS THOMAS;ANDERSON KENT M.;LANGE ERIC C.;LIM ROY;TRIEU HAI H.;BRUNEAU AURELIEN
分类号 A61F2/30 主分类号 A61F2/30
代理机构 代理人
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