发明名称 Light emitting package and light emitting package array
摘要 Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.
申请公布号 US2007267637(A1) 申请公布日期 2007.11.22
申请号 US20070798390 申请日期 2007.05.14
申请人 SAMSUNG ELECTRO-MECHANICS CO., 发明人 KIM HYUNG-KUN;KIM YU-SIK
分类号 H01L33/44;H01L33/58;H01L33/60;H01L33/62 主分类号 H01L33/44
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