METHOD OF RESIN ENCAPSULATION MOLDING FOR ELECTRONIC PART

摘要

A resin encapsulation molding apparatus comprises die assembly (50) of triple die structure and mold release film (15) for covering two cavities (26) respectively corresponding to two substrates (1). Each of the two cavities (26) comprises inferior die cavity face (29), cavity side face (30) and cavity face (32) consisting of communication channel face (31). The mold release film (15) in the state of being tensioned covers each of the two cavities (26) along the morphology thereof. In this condition, molten resin (5) is injected into the two cavities (26). The molten resin (5) is evenly distributed into the two cavities (26) through communication channel (27) communicating the two cavities (26) with each other. Thereafter, the multiple electronic parts on the two substrates (1) are almost simultaneously immersed in the molten resin (5) within the two cavities (26) and are compression molded.