Device for galvanic coating of non-magnetic silicon substrate wafer for microelectronics, has permanent- and/or electromagnets with magnetic stray field strengths arranged on a back side of the silicon surface/on the substrate holder

摘要

The device for galvanic coating of large non-magnetic surfaces of silicon substrate wafers (1) for microelectronics, has permanent- and/or electromagnets with different magnetic stray field strengths arranged on a parts of a back side of the substrate surface or on the substrate holder. The effective magnetic stray field strength is 10-100 T/m2>. The electromagnets are individually controllable. The permanent magnets are adjustably arranged in the direction of the substrate holder in its height over the backside. The device for galvanic coating of large non-magnetic surfaces of silicon substrate wafers (1) for microelectronics, has permanent- and/or electromagnets with different magnetic stray field strengths arranged on a parts of a back side of the substrate surface or on the substrate holder. The effective magnetic stray field strength is 10-100 T/m2>. The electromagnets are individually controllable. The permanent magnets are adjustably arranged in the direction of the substrate holder in its height over the backside. Ring shaped iron cores (3) and copper windings (2) are present in the device. An independent claim is included for a method for galvanic coating of non-magnetic silicon substrate wafer for microelectronics.