| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a camera module and its manufacturing method which can reduce manufacturing cost by making it possible to photograph both front and rear directions by one camera module, realizing miniaturization of a device, laminating two image sensor wafers into double-sided use, and using it. <P>SOLUTION: The camera module is provided with a first and a second image sensor chips whose respective back planes are adhered by non-conductive adhesive; a device board in which the first image sensor chip out of the first and the second sensor chips is mounted to be connected to an electrical signal by a bump for signal connection, the second image sensor chip is mounted to be connected to an electric signal by a wire, and simultaneously a through-hole is formed in an inside unit of a region where the first image sensor chip is mounted; an infrared blocking filter which is prepared in the through-hole of the device board; and a first and a second lenses which are respectively set in holders. <P>COPYRIGHT: (C)2008,JPO&INPIT |
