发明名称 MULTILAYER WINDING INDUCTOR
摘要 A multilayer winding inductor. The inductor at least includes multi-level interconnect and single-level interconnect structures. The multi-level interconnect structure includes a plurality of conductive plugs and a plurality of looped conductive traces overlapping and separated from each other. Each looped conductive trace has a gap to define first and second ends and at least two conductive plugs disposed between the neighboring looped conductive traces. The single-level interconnect structure is located over the multi-level interconnect structure, comprising an uppermost looped conductive trace and a second conductive plug. The uppermost looped conductive trace has a gap to define first and second ends, and the second conductive plug is disposed between the second end of the uppermost looped conductive trace and the first end of the looped conductive trace adjacent thereto, thereby electrically connecting the multi-level and single-level interconnect structures.
申请公布号 US2007267718(A1) 申请公布日期 2007.11.22
申请号 US20060558944 申请日期 2006.11.13
申请人 VIA TECHNOLOGIES, INC. 发明人 LEE SHENG-YUAN
分类号 H01L29/00 主分类号 H01L29/00
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