发明名称 Electronic device substrate, electronic device and methods for making same
摘要 An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.
申请公布号 US2007269590(A1) 申请公布日期 2007.11.22
申请号 US20060645948 申请日期 2006.12.27
申请人 HITACHI CABLE, LTD.;NEC ELECTRONICS CORPORATION 发明人 MIYAMOTO NOBUAKI;CHINDA AKIRA;HIRASAWA KOKI;UCHIDA KENJI
分类号 B05D5/12 主分类号 B05D5/12
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