发明名称 |
Electronic device substrate, electronic device and methods for making same |
摘要 |
An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.
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申请公布号 |
US2007269590(A1) |
申请公布日期 |
2007.11.22 |
申请号 |
US20060645948 |
申请日期 |
2006.12.27 |
申请人 |
HITACHI CABLE, LTD.;NEC ELECTRONICS CORPORATION |
发明人 |
MIYAMOTO NOBUAKI;CHINDA AKIRA;HIRASAWA KOKI;UCHIDA KENJI |
分类号 |
B05D5/12 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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