A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

摘要

A method for manufacturing a semiconductor apparatus is provided to enhance the productivity and reduce costs by preventing generation of resin residues and cracks when cutting a gate hardening resin and an air vent hardening resin. A lead frame(1) includes a frame part, a plurality of leads(3) and a plurality of tub-suspension leads(4) for supporting a tub. A semiconductor chip is mounted at a side of the tub. An electrode of the semiconductor chip is connected electrically to an inner end of the leads by using a connection tool. The semiconductor chip or the inner end of the leads is encapsulated by an encapsulater which is formed with an insulative resin by using a transfer mold. Simultaneously, the leads or the tub-suspension lead is exposed to the mounting surface of the encapsulater. The leads and the tub-suspension lead are cut.