| 摘要 |
PROBLEM TO BE SOLVED: To hold the favorable blowout state of an electric fuse. SOLUTION: A semiconductor device 100 is formed on a semiconductor wafer (not shown), and includes an electric fuse 200 composed of a conductor. In a state before blowout, the electric fuse 200 includes upper layer wiring 134, a via 128 connected with the upper layer wiring 134, and lower layer wiring 122 connected with the via 128 each formed in a different layer. In a blowout state, the conductor flows outward from the upper layer wiring 134 to form an outflow 142, and an air gap 140 is formed between the lower layer wiring 122 and the via 128. COPYRIGHT: (C)2008,JPO&INPIT |
