发明名称 |
PLATED SUBSTRATE AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a plated substrate in which a fine pattern is formed with good precision and to provide a method for manufacturing the same. SOLUTION: The method for manufacturing the plated substrate is based on an electroless plating method and includes a process for forming a catalyst layer on an area except a prescribed pattern on a substrate and a process for forming a metal layer having the prescribed pattern by depositing a metal on the substrate by dipping the substrate in an electroless plating solution. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2007302973(A) |
申请公布日期 |
2007.11.22 |
申请号 |
JP20060134742 |
申请日期 |
2006.05.15 |
申请人 |
SEIKO EPSON CORP |
发明人 |
KIMURA SATOSHI;KIJIMA TAKESHI;FURUHATA HIDEMICHI;KANEDA TOSHIHIKO |
分类号 |
C23C18/18;C23C18/52;H05K3/18 |
主分类号 |
C23C18/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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