发明名称 PLATED SUBSTRATE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a plated substrate in which a fine pattern is formed with good precision and to provide a method for manufacturing the same. SOLUTION: The method for manufacturing the plated substrate is based on an electroless plating method and includes a process for forming a catalyst layer on an area except a prescribed pattern on a substrate and a process for forming a metal layer having the prescribed pattern by depositing a metal on the substrate by dipping the substrate in an electroless plating solution. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007302973(A) 申请公布日期 2007.11.22
申请号 JP20060134742 申请日期 2006.05.15
申请人 SEIKO EPSON CORP 发明人 KIMURA SATOSHI;KIJIMA TAKESHI;FURUHATA HIDEMICHI;KANEDA TOSHIHIKO
分类号 C23C18/18;C23C18/52;H05K3/18 主分类号 C23C18/18
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