发明名称 |
Halbleiterleistungsbauteilstapel in Flachleitertechnik mit oberflächenmontierbaren Außenkontakten und ein Verfahren zur Herstellung desselben |
摘要 |
<p>A power semiconductor component stack, using lead technology with surface-mountable external contacts, includes at least two MOSFET power semiconductor components each having a top side and an underside. The underside includes: a drain external contact area, a source external contact area and a gate external contact area. The top side includes at least one source external contact area and a gate external contact area. The gate external contact areas on the top side and the underside are electrically connected to one another. The power semiconductor component stack is a series circuit or a parallel circuit of MOSFET power semiconductor components arranged one above another in a plastic housing composition.</p> |
申请公布号 |
DE102005027356(B4) |
申请公布日期 |
2007.11.22 |
申请号 |
DE20051027356 |
申请日期 |
2005.06.13 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HOSSEINI, KHALIL;KOENIGSBERGER, ALEXANDER;OTREMBA, RALF;MAHLER, JOACHIM;SCHLOEGEL, XAVER;SCHIESS, KLAUS |
分类号 |
H01L25/07;H01L21/50 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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