SUBSTRATE BONDING APPARATUS

摘要

A vacuum bonding apparatus is provided to fix a substrate through a vacuum suction method instead of static electricity force to prevent the substrate from damaged by the static electricity. A vacuum bonding apparatus comprises a vacuum chamber(100), upper and lower stages(110,120) and a pumping unit(130). The upper and lower stages are located within the vacuum chamber. The pumping unit generates vacuum pressure lower than vacuum pressure within the vacuum chamber so that the upper and lower stages can perform vacuum suction of a substrate. The upper and lower stages have plural suction holes(134) arranged at equal intervals to perform the vacuum suction over an entire area of the substrate.