| 摘要 |
<p>PURPOSE: A diode package is provided to improve the electrical characteristic by enlarging the die pad electrically connected to the anode and directly connecting the cathode to the board. CONSTITUTION: A diode package(1000) includes a diode chip(100), a lead frame, and an adhesive(300). The lead frame has a die pad(210) supported by a support(220) while being protruded from the support(220) and contacting an anode(130) on the diode chip(100), and an anode lead(230) surrounding the lateral side of the diode chip(100) while being spaced apart from the diode chip(100) by a predetermined distance and angled against the support(220) by a predetermined degree. The adhesive(300) is used for adhering the die pad(210) of the lead frame to the anode(130) of the diode chip(100).</p> |
