| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device where a via distribution is uniformly obtained on the surface of a substrate, and to provide a method for generating a wiring auxiliary pattern. SOLUTION: A semiconductor integrated circuit includes first wiring and second wiring arranged in the upper layer of the first wiring. A region with low via pattern density is extracted based on wiring layout information in the semiconductor integrated circuit. Then, a dummy via pattern connected to the first or second wiring is arranged in the peripheral region of the via pattern in the selected region. Consequently, a dummy via is arranged even in a place with congested wiring. COPYRIGHT: (C)2008,JPO&INPIT |
