RESIN SEALING DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin sealing device controlling the formation of resin burrs in a resin sealing process, and to provide a manufacturing method of a semiconductor device. SOLUTION: Cavities 4 where semiconductor chips are arranged are formed on the abutting face of an upper mold 2 and a lower mold 3. A pot 7 to which resin is supplied and the respective cavities 4 are connected by gates 9 and runners 10. Via holes 11 which pass through the upper mold 2 or the lower mold 3 and which go from outside the mold to the abutting face are formed in parts that are not directly connected to a region (resin passage) comprising the pot 7, the cavities 4, the gates 9, and the runners 10 with resin passing through. COPYRIGHT: (C)2008,JPO&INPIT