| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for a semiconductor integrated circuit in which appropriate contact pressure is applied to all external terminals of a semiconductor package when testing the semiconductor integrated circuit. SOLUTION: The semiconductor package socket includes first contact pins 100, 110, 120, 130, second contact pins 200, 210, 220, 230, and a main body 300. The first contact pins 100, 110, 120, 130 are brought into contact with a first terminal arranged on the semiconductor package 10. The second contact pins 200, 210, 220, 230 are brought into contact with a second terminal arranged on the same surface of the semiconductor package 10 as the first terminal. The height of the second terminal from the same surface of the semiconductor package 10 is different from that of the first terminal. The main body 300 supports the first contact pins 100, 110, 120, 130 and the second contact pins 200, 210, 220, 230 arranged on the same surface. COPYRIGHT: (C)2008,JPO&INPIT
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