PHENOLC COMPOUND, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent flame retardance, solder resistance and reliability of moisture resistance and to provide a semiconductor device using the same. SOLUTION: The epoxy resin composition consists essentially of a compound (A) and a phenolic compound (B). The compound (A) has≥2 epoxy groups in one molecule. The phenolic compound (B) is represented by general formula (1) [wherein, R1to R4represent each hydrogen, an alkyl group or a phenyl group; and m and n are each 0 or an integer of≥1]. COPYRIGHT: (C)2008,JPO&INPIT