| 摘要 |
A prober that has improved positional precision of probing without reducing throughput is disclosed. The prober comprises a probe card having a probe, a wafer stage, a stage temperature adjustment mechanism, a wafer stage movement mechanism, a movement control section, and an alignment mechanism that detects the relative position between an electrode and the probe, wherein the movement control section controls the movement mechanism so as to cause the electrode to come into contact with the probe based on the detected relative position, and the prober further comprises a plurality of temperature sensors that detect the temperatures of a plurality of portions of the prober including the wafer stage and a predicted change amount calculation section that calculates the amount of change in relative position between the electrode and the probe based on a prediction model that uses at least part of the temperatures of the plurality of portions and the temperature difference between the wafer stage and the other sections as a variable.
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