The present disclosure includes various method, circuit, device, and system embodiments. One such method embodiment includes creating a trench (527) in an insulator stack material (222) having a portion of the trench positioned between two of a number of gates (112) and depositing a spacer material (630) to at least one side surface of the trench. This method also includes depositing a conductive material (732, 834) into the trench and depositing a cap material into the trench.
