| 摘要 |
A film peeling device for peeling a film ( 11 ) adhered to a front surface of a wafer ( 20 ), on the back surface of which a dicing tape ( 3 ) is adhered, the wafer is integrated with a mount frame ( 36 ) into one body, comprises: a movable table ( 31 ), which can be moved horizontally to support the wafer and the mount frame while the surface protection film is being directed upward; a covering means ( 80 ) for covering an adhesive face ( 3 a) of the dicing tape, which is exposed between the mount frame and the wafer at one end ( 28 ) of the wafer; and a adhering means ( 46 ) for adhering a peeling tape ( 4 ) to the film at the end of the wafer. The film is peeled from the front surface of the wafer by moving the movable table from the other end ( 29 ) of the wafer to one end after the peeling tape has adhered. Due to the foregoing, while the peeling tape is being prevented from adhering to the dicing tape, the film can be peeled from the front surface of the wafer in a shorter period of time.
|
