| 摘要 |
Light-emitting device assemblies are described. The assemblies can include a light-emitting device, an optional package supporting the light-emitting device, and a base supporting the light-emitting device or the optional package. The base may include a protrusion extending in the direction of the light-emitting device. The thermally conductive pathway can extend between the light-emitting device and the base, such that the thermally conductive pathway includes the protrusion. Other assemblies can include a light-emitting device, a support substrate, and a layer of dielectric material on the support substrate. An aperture may be defined by the dielectric material through which a thermally conductive material (e.g., a portion of the support substrate) can extend to facilitate thermal communication between the support substrate and the light-emitting device. Thermal communication between the support substrate and the light-emitting device can increase the removal of thermal energy generated by the device.
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