发明名称 Wiring board
摘要 A wiring board (1) of the present invention readily controls a power source voltage and unwanted irradiation noises developed across a power source layer (5) and a ground layer (6) over a broad range of frequencies with a simple arrangement. The wiring board (1) has an on-board surface (3) on the surface of a dielectric substrate (2), on which a semiconductor device (4) or the like is mounted, and a power source layer (5) and a ground layer (6), which are made of a conductor material principally composed of at least one kind of element selected from Cu, W, and Mo, are provided on the back surface of the dielectric substrate (2) or within the same. The periphery of at least one of low resistance areas (5a, 6a) of the power source layer (5) and ground layer (6), respectively is provided with a corresponding high resistance area (5b or 6b) having a higher sheet resistance than that of the respective low resistance areas (5a, 5b). <IMAGE>
申请公布号 EP1130950(B1) 申请公布日期 2007.11.21
申请号 EP20010104820 申请日期 2001.02.27
申请人 KYOCERA CORPORATION 发明人 TAKESHITA YOSHIHIRO;TERAO SHINYA;TAKENOUCHI SATORU;KAJI, MASAKI;KOGA, RYUJI
分类号 H05K1/02;H01L23/498;H01L23/50;H01R12/55;H05K1/00;H05K1/16 主分类号 H05K1/02
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