发明名称 METHOD FOR CONNECTING FLEXIBLE PRINTED CIRCUIT BOARD TO ANOTHER CIRCUIT BOARD
摘要 <p>A method for connecting FPC to a second circuit board, comprising the steps of (i) preparing a flexible printed circuit board (FPC) and a second circuit board, (ii) disposing the connection parts of the FPC to face the connection parts of the second circuit board such that a thermosetting adhesive film is present between the connection parts of the FPC and the connection parts of the second circuit board, and (iii) applying heat and pressure sufficiently high to thoroughly push away the adhesive film for establishing electrical contact and allow for curing of the adhesive, wherein the ratio of conductor width (L)/conductor-to-conductor distance (S) in the conductor wiring end parts constituting the connection parts of FPC is 0.5 or less and the thermosetting adhesive film is adjusted to have a viscosity of 500 to 20,000 Pa.s at 200° C.</p>
申请公布号 EP1856770(A1) 申请公布日期 2007.11.21
申请号 EP20060737119 申请日期 2006.03.07
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 KAWATE, KOHICHIRO;HIRASAWA, YUJI;SATO, YOSHIAKI
分类号 H01R12/08;H01R12/24 主分类号 H01R12/08
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