Three-dimensional Multi-Chips and tri-axial sensors and methods of manufacuring the same

摘要

Devices for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction and methods of their manufacture are disclosed. The devices comprise a leadframe (10), at least one X- and Y-axis sensor die (17), at least one integrated circuit (19), and a Z-axis sensor. The Z-axis sensor is encapsulated in a pre-molding (15) before the leadframe, X- and Y-axis sensor die(s), integrated circuit(s), and the pre-molding are encapsulated to provide a final molding.