Printed circuit board structure having a layer at one of its surfaces for dissipating heat by convection,申请号EP20060008023-传众专利搜索

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发明名称	Printed circuit board structure having a layer at one of its surfaces for dissipating heat by convection
摘要
申请公布号	EP1715732(A3)	申请公布日期	2007.11.21
申请号	EP20060008023	申请日期	2006.04.18
申请人	ASUSTEK COMPUTER INC.	发明人	CHEN, YUEH-CHIH;CHANG, KAI-SHUN
分类号	H05K1/02;H05K3/46	主分类号	H05K1/02
代理机构		代理人
主权项
地址

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