Heat sink electronic package having compliant pedestal

摘要

An electronic package (10) is provided for dissipating heat away from electronic devices (22). The package (10) includes a substrate (20) and electronic devices (22) mounted on the substrate (20). The package (10) also has a thermally conductive heat sink (12) assembled over the electronic device (22). The heat sink (12) includes compliant pedestals (30) each having a contact surface (38) for contacting a surface of an electronic device (22) to conduct thermal energy away from the electronic device (22). The package (10) is held together such that the heat sink (12) is in contact with the surface of an electronic device (22) such that each compliant pedestal (30) applies a compressive force to the surface of the electronic device (22).