| 发明名称 |
LEAD FRAME AND ITS MANUFACTURING METHOD |
| 摘要 |
<p>The semiconductor device mounting surface and substrate mounting surface of a metallic sheet (1) of a lead frame are plated with palladium (1a). The formed lead part, pad part, no-mounting surfaces, and side faces are not plated.</p> |
| 申请公布号 |
EP1406300(A4) |
申请公布日期 |
2007.11.21 |
| 申请号 |
EP20020743870 |
申请日期 |
2002.07.09 |
| 申请人 |
SUMITOMO METAL MINING COMPANY LIMITED |
发明人 |
IITANI, KAZUNORI;HAMADA, YOUICHIROU |
| 分类号 |
H01L23/50;H01L21/48;H01L23/495 |
主分类号 |
H01L23/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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