Assembly for cooling SMD high performance components on a PCB

摘要

Cooling system comprises a board-shaped mounting substrate (2) on which electrical component is mounted on side of the substrate. A bent sheet-metal part (3) is assigned to the electrical component disposed on same side of the substrate as the electrical component. It has heat sink element(s) (8) extending in longitudinal direction oriented obliquely to plane of the substrate. A thermally conductive layer (4) is implemented on the substrate to connect the heat sink with the electrical component. A solder joint (11) is between the bent sheet-metal part and the thermally conductive layer. The electrical component is a surface mount device (SMD) power component. The substrate is a printed circuit board. The sheet-metal part is coated with a solderable surface. It consists of a solderable material. The bent sheet-metal part is a punch-bended copper sheet or partially tin-coated. It has U-shaped section-with legs, in which ends of legs are connected to the thermally conductive layer based on the solder joint.