| 摘要 |
A reed-shaped holding gripper is provided for holding a semiconductor wafer at the time of measuring the shape of the semiconductor wafer. In the holding gripper, a side for holding the semiconductor wafer has a round shape, a groove for holding an edge of the semiconductor wafer is provided on a side plane of the round-shaped section along the side plane, and the semiconductor wafer is held by having the groove abut to the edge of the semiconductor wafer from the periphery of the wafer. Thus, the gripper which stably holds the wafer in a certain state even the gripper is inclined when holding the wafer, a holding method thereof, and a shape measuring apparatus are provided. |
