PACKING CASE OF CORRUGATED CARDBOARD WITH SPACE IN THE UPPER COMPARTMENTS FOR ACCESSORIES, DESIGNED TO PROVIDE PROTECTION AGAINST SHOCKS EVEN IF OVERTURNED,申请号EP20050719047-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	PACKING CASE OF CORRUGATED CARDBOARD WITH SPACE IN THE UPPER COMPARTMENTS FOR ACCESSORIES, DESIGNED TO PROVIDE PROTECTION AGAINST SHOCKS EVEN IF OVERTURNED
摘要
申请公布号	EP1855949(A1)	申请公布日期	2007.11.21
申请号	EP20050719047	申请日期	2005.03.22
申请人	ASSOGRAPH ITALIA S.R.L.	发明人	GORETTI, FRANCO
分类号	B65D5/50	主分类号	B65D5/50
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Adjustable connector for marine accessories

IMAGE READING APPARATUS AND CONTROL METHOD OF IMAGE READING APPARATUS

LOW ENERGY SURFACE BONDING SYSTEM CONTAINING A PRIMER WITH LONG OPEN TIME

A FRAGRANCE-DELIVERY COMPOSITION COMPRISING BORON AND PERSULFATE ION-CROSSLINKED POLYVINYL ALCOHOL MICROCAPSULES AND METHOD OF USE THEREOF

PROTEIN STRUCTURAL BIOMARKERS TO GUIDE TARGETED CHEMOTHERAPIES

CARBOXAMIDE COMPOUNDS AND THEIR USE AS CALPAIN INHIBITORS

TISSUE REMOVAL DEVICE FOR NEUROSURGICAL AND SPINAL SURGERY APPLICATIONS

CONDENSING UNIT HAVING FLUID INJECTION

NOVEL COMPOUNDS FOR AN ORGANIC PHOTOELECTRIC DEVICE, AND ORGANIC PHOTOELECTRIC DEVICE COMPRISING SAME

SEMICONDUCTOR CHIP WITH REINFORCEMENT LAYER

PROCESS FOR USE WITH BREASTPUMP TO INITIATE MILK IN BREASTFEEDING, PARTICULARLY FOR PREMATURE INFANTS

PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV)

SYSTEM AND METHOD FOR PROCESSING ALGAE

A METHOD AND ARRANGEMENT FOR VAPOUR PHASE COATING OF AN INTERNAL SURFACE OF AT LEAST ONE HOLLOW ARTICLE

FLUID COMMUNICATION PATH

SINTERING PRECURSOR POWDERS FOR MANUFACTURING DIELECTRIC SUBSTANCE AND METHOD FOR MANUFACTURING THE SAME

ELECTROLYTIC CELL AND METHOD OF USE THEREOF

SEMICONDUCTOR MEMORY DEVICE INCORPORATING CONTROLLER

LIGHT EMITTING PACKAGE CONTROLLING COLOR TEMPERATURE, FABRICATING METHOD THEREOF, COLOR TEMPERATURE CONTROLLING METHOD OF LIGHT EMITTING PACKAGE