发明名称 A COOLING STRUCTURE FOR PORTABLE COMPUTER
摘要 <p>A cooling structure for portable computer is provided to reduce a space necessary for a plurality of heating components by installing the heating components on upper and lower surfaces of a main substrate. A main board(32) is installed in an internal space(30') of a main body(30). A cooling fan unit(40) is installed in the inside of the main body to form air current for discharging the internal heat to the outside. A first heat pipe(50) is formed to transmit the heat generated from a first heating source(33) formed on one side of the main board to a path for discharging the air current formed by the cooling fan unit. A second heat pipe(60) is formed to transmit the heat generated from a second heating source(34,35) formed on the other side of the main board to the path for discharging the air current formed by the cooling fan unit.</p>
申请公布号 KR20070111244(A) 申请公布日期 2007.11.21
申请号 KR20060044375 申请日期 2006.05.17
申请人 LG ELECTRONICS INC. 发明人 KO, KI TAK
分类号 G06F1/20;G06F1/16 主分类号 G06F1/20
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