发明名称 |
METHOD FOR PRODUCING A COMPONENT |
摘要 |
<p>An electrical and/or optical component and a process for manufacturing the component achieve especially good quality in the component and especially reliably avoid crystal dislocations in material layers of the component. In the process for producing a component, at least one trench is etched into a substrate, the trench is overgrown laterally by at least one semiconductor layer in such a way that the trench is completely covered by the semiconductor layer while forming a gas-filled, especially air-filled, cavity, and the component is integrated in the semiconductor layer or in a further semiconductor layer applied to the semiconductor layer, with an active region of the component being placed above the cavity.</p> |
申请公布号 |
EP1856720(A2) |
申请公布日期 |
2007.11.21 |
申请号 |
EP20060722565 |
申请日期 |
2006.03.01 |
申请人 |
TECHNISCHE UNIVERSITAET BERLIN |
发明人 |
STRITTMATTER, ANDRE;REISSMANN, LARS;BIMBERG, DIETER |
分类号 |
H01L21/20;H01L33/00;H01L33/20 |
主分类号 |
H01L21/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|