SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A semiconductor device and a manufacturing method of the same are provided to arrange and install a bump electrode by using a base layer including nickel on an electrode pad. A plurality of electrode pads(13) are arranged on one main surface of a semiconductor substrate(11). A copper layer is formed on a surface of each of the electrode pads. The copper layer is formed by using aluminum as a main material. A bump base layer is arranged on the electrode pads. A bump is arranged on the electrode pads through the bump base layer. The copper layer is formed with a discontinuous layer having a shape of spot or spackle or a shape of island. The density of the copper layer is reduced from the surface of each of the electrode pads in a thickness direction. The bump base layer is formed with a nickel layer.