| 摘要 |
<p>A submount provided with an electrode layer having excellent wettability for solder bonding, and a method for manufacturing such submount are provided. In the submount (1) whereupon a semiconductor device is to be mounted, a substrate protecting layer (3) is formed on a surface of a submount substrate (2), the electrode layer (4) is formed on the substrate protecting layer (3), and a solder layer (5) is formed on the electrode layer (4). The average roughness of the surface of the electrode layer (4) is smaller than 0.1mum. Since the surface average roughness of the electrode layer (4) is small, the wettability of the solder layer (5) is improved, and the solder layer (5) can be firmly bonded with the semiconductor device without flux. The submount (1) having a small thermal resistance when the semiconductor device is mounted is provided, thus, temperature increase in the semiconductor device is permitted to be small and the performance and life of the semiconductor device are improved.</p> |
