SUBSTRATE PROCESSING APPARATUS

摘要

A substrate processing apparatus is provided to uniformly heat a substrate placing unit by installing a plurality of lamp heaters under a substrate placing unit. A gas injection unit injects gas to the inside of a chamber(100). A substrate placing unit(200) on which a plurality of substrate placing parts(220) are placed is installed in the chamber. An optical heating unit(400) heats the substrate placing unit, installed under the substrate placing unit. The heat of the optical heating unit is supplied to the substrate placing unit by a heat guiding unit(500) including a heating transmitting part(510) and a heat blocking unit(520). The heat transmitting part transmits the radiant heat of the optical heating unit. The heat blocking part surrounds the optical heating unit in a region except the heat transmitting part, avoiding transmission of radiant heat.