| 摘要 |
Embodiments of the present invention provide a mounting assembly ( 100 ) for mounting an electronic device (D) to a surface (S). The mounting assembly ( 100 ) generally includes a base ( 102 ) including a mounting ball ( 110 ) and a socket assembly ( 104 ) operable to frictionally engage the ball ( 110 ) to removably couple the socket assembly ( 104 ) to the base ( 102 ). The base ( 102 ) may be removably coupled with the surface (S) and the socket assembly ( 104 ) may be removably coupled with the electronic device (D). Such a configuration enables the electronic device (D) to be easily positioned in confined environments by first attaching the base ( 102 ) to the surface (S), then attaching the socket assembly ( 104 ) to the base ( 102 ) and positioning the socket assembly ( 104 ) in a desired orientation, and finally attaching the electronic device (D) to the socket assembly ( 104 ).
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