MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

摘要

A manufacturing method of a PCB(Printed Circuit Board) is provided to form a high density circuit by forming the circuit in a part occupied by a land, and to realize the PCB with a fine pattern by forming more circuits on an insulating substrate with the same area. A manufacturing method of a PCB includes the steps of: laying a first circuit pattern and a second circuit pattern at one side and the other side of an insulating substrate respectively(S10); forming a via hole by removing the insulating substrate and a part of the first circuit pattern(S20); and electrically connecting the first circuit pattern and the second circuit pattern by forming a plating layer at the via hole(S30).