| 摘要 |
According to an aspect of the present invention, there is provided an LSI package with an interface module including: an interposer, on which a signal processing LSI is mounted, having a mounting board connecting electrical terminal; and an interface module having a transmission line to wire a high-speed signal to the exterior and a socket connecting electrical terminal corresponding to a mounting board connecting socket, in which the interposer and the interface module have at least either loop electrodes or plate electrodes, respectively, and the interposer and the interface module are electrically connected by inductive coupling, electrostatic coupling, or combined coupling of these two couplings by at least either the loop electrodes or the plate electrodes. |
