| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection that has, after curing, a high reflectance of visible light to near-ultraviolet light, and excellent in heat deterioration resistance, and to provide a substrate for loading photosemiconductor device using the same, method for producing the same, and a photosemiconductor device. <P>SOLUTION: The thermosetting resin composition for light reflection comprises (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (F) a coupling agent, and (G) an antioxidant as components, and shows, after curing, a light reflectance of at least 80% in a wave length range of 350-800 nm. <P>COPYRIGHT: (C)2008,JPO&INPIT |
