Production of electronic component with semiconductor element bonded and fastened on a substrate, comprises applying a gold layer on the substrate surface and spray coating of the element and/or the surface with hardening/ curing component

摘要

The production of an electronic component with a semiconductor element (1) bonded and fastened on a substrate, comprises applying a structured gold layer (5) on the substrate surface, reversible spray coating of the semiconductor element and/or the substrate surface (2) with an adhesive structure from a hardening or curing component (3) and an electrically conductive, non-curing component (4), producing a border area section-wise coated with the curing component by a shadow panel, and central area section-wise coated with the non-curing component by a perforated sheet. The production of an electronic component with a semiconductor element (1) bonded and fastened on a substrate, comprises applying a structured gold layer (5) on the substrate surface, reversible spray coating of the semiconductor element and/or the substrate surface (2) with an adhesive structure from a hardening or curing component (3) and an electrically conductive, non-curing component (4), producing a border area section-wise coated with the curing component by a shadow panel, and central area section-wise coated with the non-curing component by a perforated sheet, and producing an alternating adhesive structure with strips out of the components. The curing component is ultraviolet (UV) or infrared (IR) networked. For hardening the curing component, an UV radiation of the adhesive layer is carried out. An independent claim is included for an electronic component.