发明名称 HEAT TREATMENT DEVICE AND HEAT TREATMENT METHOD AND STORAGE MEDIUM
摘要 A heat treatment device, a heat treatment method, and a storage medium are provided to obtain constant processing accuracy by maintaining internal temperature of a heat treatment chamber at processing temperature through closing/opening a cover. A heating plate(51) is installed in an inside of a heat treatment chamber(54). The heat treatment chamber is opened or closed according to operations of a cover(55). A heat treatment method includes a process for maintaining the temperature of the heat treatment chamber at the predetermined temperature by operating the cover, a process for transferring a target substrate into the inside of the heat treatment chamber, and a process for performing a heat treatment process by heating the target substrate. The process for opening and shutting the cover is performed repeatedly. The predetermined temperature is set on the basis of the heat treatment temperature.
申请公布号 KR20070109881(A) 申请公布日期 2007.11.15
申请号 KR20070044859 申请日期 2007.05.09
申请人 TOKYO ELECTRON LIMITED 发明人 FUJII KATSUHISA;ODA TETSUYA;KUBO AKIHIRO
分类号 H01L21/324;H01L21/027 主分类号 H01L21/324
代理机构 代理人
主权项
地址